SiC_p/Cu复合材料的SPS烧结及组织性能  

Study on Microstructure and Properties of SiC/Cu Composites Fabricated by Spark Plasma Sintering

作　　者：章林[1] 曲选辉[1] 段柏华[1] 何新波[1] 路新[1] 秦明礼[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《稀有金属》2008年第5期614-619,共6页Chinese Journal of Rare Metals

基　　金：国家863计划项目(2006AA03Z557);国家973计划项目(2006CB605207);国家自然科学基金项目(5063410);教育部长江学者和创新团队发展计划(I2P407)资助

摘　　要：以化学镀Cu包覆SiC粉末和高压氢还原法制备的Ni包SiC复合粉末为原料,用放电等离子体烧结法制备了SiCp/Cu复合材料。分析了增强相含量和烧结温度对致密化的影响,比较了非包覆粉末和包覆粉末制备的复合材料的界面结合状况,然后对SiCp/Cu复合材料的热膨胀行为和力学性能进行了研究。结果表明:包覆粉末能够促进材料的致密化并且能获得良好的界面结合,所得SiCp/Cu复合材料的致密度达96.7%,抗压强度达1061MPa。SiCp/Cu复合材料的热膨胀系数介于7.5×10-6～11.4×10-6·K-1之间,并且随SiC体积分数的增加而降低。材料在热循环过程中出现热滞现象,热滞现象受增强相的含量及界面结合状况的影响。SiC/Cu composites were prepared with Cucoated SiC produced by electroless plating and Nicoated SiC powder prepared by hydrogen reduction under high pressure as raw materials by using spark plasma sintering （SPS） technology. The effects of content of reinforcing phase and sintering temperature on densification behavior were considered. And the interface connect of the composites with coated and uncoated powders were studied. Then their microstructure, the thermal expansion behavior and mechanical properties were investigated also. From these results, it could be concluded that using coated powders densification and bonding strength of interface of the composites were improved and enhanced. The relative density was 96.7% and compressive strength reached 1012 MPa. Thermal expansion coefficient of SiC/Cu composites ranged between 7.5 - 11.4 × 10^-6·K^- 1 and decreased with increasing SiC content. Thermal hysteresis phenomenon emerged during the thermal cycling and was influenced under the content of reinforcing phase and interface bonding strength.

关 键 词：SiCp/Cu复合材料的SPS烧结及组织性能 

分 类 号：TB333[一般工业技术—材料科学与工程]