耐高温有机胶粘剂的研究进展  

Development survey of high-temperature resistant organic adhesives

作　　者：齐贵亮 王喜梅[1] 张玉龙[1] 

机构地区：[1]中国兵器工业集团第五三研究所,山东济南250031

出　　处：《粘接》2008年第11期47-51,共5页Adhesion

摘　　要：对当前国内外耐高温胶粘剂进行了综述。介绍了环氧树脂、酚醛树脂、有机硅、聚酰亚胺、聚苯并咪唑和聚苯基喹嗯啉等耐高温胶粘剂的物理化学性能,以及提高耐高温胶粘剂耐高温性能的一些技术途径和改性方法,并对耐高温胶粘剂的发展趋势进行了展望。In this paper, the current progress of the high-temperature resistant organic adhesive at home and abroad was summarized. The physical and chemical properties of high temperature resistant adhesives based on epoxy resin,phenolie resin,organic silicone, polyimide, polyhenzimidazole （PBI） and poly（phenylquinolinoxaline） （PPQ） were introduced. Some technological approaches and modifying methods of enhancing high-temperature resistance of adhesives were also described. Finally, some suggestions about the further development of high-temperature resistant organic adhesives were prospected.

关 键 词：耐高温 环氧树脂 酚醛树脂 有机硅 聚酰亚胺 聚苯并咪唑 聚苯基喹噁啉 

分 类 号：TQ433[化学工程]