高温超导窄带低插损小型化双工器的仿真研究  

THE SIMULATION AND RESEARCH OF THE NARROWBAND LOW-LOSS MINIATURIZATION HTS DIPLEX

作　　者：来晋明[1] 羊恺[1,2] 宁俊松[1,2] 

机构地区：[1]电子科技大学电子工程学院,610054 [2]电子科技大学空天科学技术研究院,成都610054

出　　处：《低温物理学报》2008年第4期343-345,共3页Low Temperature Physical Letters

摘　　要：采用IE3D软件,利用全波电磁仿真方法设计研究了高温超导窄带低插损小型化微波双工器,采用的材料是在厚度为0.5mm介电常数为23.5的LaALO3衬底上用磁控溅射法制备而成的双面氧化物高温超导薄膜YBCO.利用在微波范围内,高温超导薄膜的Q值比常规导体高1～3个数量级的特点和其高介电常数的特点,实现了器件的低插损和小型化.In this paper, the author used the full-wave electromagnetic simulation to research the narrowband low-loss miniaturization HTS diplexer by using the software of IE3 D. The diplexer is manufactured on the double-sided HTS YBCO film on a LaAlO3 substrate of 0.5mm. The miniaturization and low insertion loss of electron devices are realized using the advantage that the quality factor of HTS film is 1 - 3 orders higher than tlle normal metals.

关 键 词：高温超导 薄膜 微波 

分 类 号：TN61[电子电信—电路与系统]