高亮度发光二极管封装用透镜胶研究进展  

Progress of Lens Adhesive for Encapsulation of High-Brightness LEDs

作　　者：张文飞[1] 贺英[1] 谌小斑[1] 

机构地区：[1]上海大学材料科学与工程学院高分子材料系,上海201800

出　　处：《微纳电子技术》2008年第11期672-676,共5页Micronanoelectronic Technology

基　　金：上海市教委重点科研项目(07ZZ13)

摘　　要：大功率LED的发光强度大,产生的热量多,其产生的短波光辐射也比小功率发光二极管大,对LED封装材料提出了新的要求。综述了发光二极管封装用透镜胶的研究现状,根据发光二极管对高分子封装材料研发的要求,着重介绍了国内外为提高有机硅封装材料的导热性、耐热性、透光性以及耐紫外线辐射和关于材料折射率的调节方法等方面所做的最新研究成果和现状。对透镜胶研发过程中的重点和难点进行了分析,认为找到合适的填料和合适的方法把填料填入有机硅基体,或者在有机硅聚合物链上引入某些基团来改善封装材料的性能是研发的关键。With the development of high-brightness LEDs （light emitting diodes）, higher luminescence intensity, more heat and stronger short-wavelength radiation put forward the new demand for LED encapsulation materials. The status of lens adhesive used for high-brightness LED encapsulation is reviewed. According to the requirement of LED to polymer encapsulation materials, the new research and development of the thermal conductivity, heat resistance, light transmittance, ultraviolet irradiation resistance and refraction index adjustment of organic silicone encapsulation materials are introduced emphatically. The emphasis and difficulty of the research of lens adhesive are analyzed. The key of research and development is suggested to fill silicone substrates with proper fillers by the proper method, or introduce certain groups into organic silicone chains in order to improve the performance of encapsulation materials.

关 键 词：发光二极管 封装胶 有机硅 导热性 透明性 折光率 

分 类 号：TN305.94[电子电信—物理电子学] O634.41[理学—高分子化学]