无铅焊接高温对元器件可靠性的影响  

Lead-free Soldering High Temperature Influences on Components Reliable Application

作　　者：王文利[1] 阎焉服[2] 吴波[1] 

机构地区：[1]深圳信息职业技术学院信息技术研究所,广东深圳518029 [2]河南科技大学,河南洛阳471003

出　　处：《电子工艺技术》2008年第6期317-318,323,共3页Electronics Process Technology

基　　金：河南省科技攻关项目(项目编号:072102260016)

摘　　要：介绍无铅工艺焊接高温对元器件可靠性的影响,指出了无铅焊接高温对元器件耐温的挑战,介绍了IPC新标准的无铅器件耐温要求,分析了无铅焊接高温带来的元器件失效问题,如"爆米花"、分层、裂纹等,以及焊接高温对器件内部连接的影响,讨论了通过实施元件热管理来解决无铅焊接高温中的热损伤与热失效的方法,对在无铅焊接工艺过程提高元器件的可靠性应用具有一定的指导意义。Lead -free soldering high temperature influences on components reliability are intro- duced, pointed out that the heat resistant challenge for components under lead -free high temperature process. The IPC new standard of lead free components heat resistance request is introduced, the primary components failure models related with lead -free soldering, like ＂pop - corn＂, delamination, crack and so on, are analyzed, as well as the soldering high temperature influences on the component internal connection is discussed. Introducing how to solve thermal damage and thermal failure through component hot management technology. This will help component reliable application in lead free soldering process.

关 键 词：无铅 高温 元器件 可靠性 

分 类 号：TN605[电子电信—电路与系统]