无铅合金与锡铅合金性能对比分析  

Contrast Performance Analysis Between Lead-free and Tin-lead Alloys

作　　者：杨光育[1] 徐欣[1] 董义[1] 

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《电子工艺技术》2008年第6期328-330,333,共4页Electronics Process Technology

摘　　要：随着人们对环境的日益重视,全球对电子组装焊料合金的无铅化和电子产品的质量要求也越来越高。介绍了无铅焊料合金的发展及技术应用情况,针对无铅焊料合金与锡铅焊料合金的物理性能、机械性能等指标进行对比,定性地分析在特殊环境下两种焊料合金形成的焊点差异。Along with people to attaching importance to the environment increasingly, the quality requirement of electronic products and the lead - free of electronic mount solder alloys have been required more and more higher in the whole world. Introduce the development and the technology, application of the lead -free solder alloys,and contrast the physics capability and mechanical performance ere between lead -free solder alloys and tin -lead solder alloys, qualitative analysis had also been used in welding spot difference of two kinds of solder alloys in special environment.

关 键 词：无铅 SN-PB 焊接 

分 类 号：TN604[电子电信—电路与系统]