电弧熔覆Ti-Si金属间化合物表面层的组织与性能  

Microsturctures and properties of Ti-Si intermetallic compound layers by arc cladding

作　　者：任振安[1] 赵继圆[1] 范珺[1] 洪贺[1] 

机构地区：[1]吉林大学汽车材料教育部重点实验室,长春130025

出　　处：《焊接学报》2008年第11期1-4,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(50671044)

摘　　要：采用在纯钛基体上预敷硅粉,然后进行电弧熔覆的表面处理技术,通过改变焊接电流调整预敷硅粉与纯钛基体的熔化量,制备Ti-Si金属间化合物表面层,使基体获得表面冶金强化。用金相显微镜、扫描电镜和X射线衍射仪,对表面层的微观结构及界面进行了分析研究,并测试了显微硬度分布和耐磨性。结果表明,随着焊接电流增加,表面层的显微组织类型由亚共晶到共晶,最后为过共晶。Ti5Si3相使表面层具有较高的硬度,耐磨性比纯钛基体有明显提高。The surface treatment technique of pre-placing silicon powders on the pure titanium substrate before arc cladding was applied to prepare Ti-Si intermetallic compound surface layers. Resulted in different fused amounts between pre-placing silicon powders and the pure titanium substrate prepare different surface layers by changing welding currents. The purpose was to strength the substrate metallurgically. The microstructures of the layers and the interfacial zone were investigated by optical microscopy, scanning electronic microscopy and X-ray diffraction. And the microhardness profiles and the abrasive resistance of the layers were measured. The experimental results showed that the microstructures of the arc cladded layers change from hypoeutectic, eutectic to hypereutectic with increasing welding currents. Ti5Si3 phase hardened the layers and made their abrasive resistance obviously higher than that of the pure titanium substrate.

关 键 词：电弧熔覆 钛硅金属间化合物 工业纯钛 表面层 耐磨性 

分 类 号：TG455[金属学及工艺—焊接]