NdFeB磁性材料化学镀Ni-Cu-P合金沉积过程分析  

Analysis of Depositing Stage of Electroless Ni-Cu-P Plating on NdFeB Permanene Magnets Materials

作　　者：王憨鹰[1,2] 陈焕铭[2] 徐靖[2] 孙安[2] 

机构地区：[1]榆林学院物理与电气工程系,陕西榆林719000 [2]宁夏大学物理电气信息学院,宁夏银川750021

出　　处：《表面技术》2008年第6期12-13,17,共3页Surface Technology

基　　金：宁夏高等学校科学研究项目(200513)

摘　　要：通过SEM观察Ni-Cu-P合金沉积过程的形貌,提出了Ni-Cu-P非晶态合金镀层形核与长大过程的沉积模型。结果表明:初期沉积过程具有明显的择优倾向和不均匀性,原子并非以单个原子的形式沉积于基体表面,而是还原后的原子在固-液界面处首先形成原子团,然后在基体表面的高能量区域优先沉积,并开始形核且以不规则形态长大;在施镀后期,随着P含量的不断增加,镀层形貌逐渐由不规则形态变为规则胞状形态,直至形成光滑平整的非晶态镀层。Observed the surface appearance of nickel copper phosphorus alloy depositing stage through SEM, the deposition model of Ni-Cu-P amorphous coatings during nucleation and growth was put forward. The result shows that there are obvious orientation of selecting the superior and disparities in the initial depositing stage. The reduced atoms cant directly, individually deposit on the surface of the matrix, they form atomic crystal at the interface between solidliquid first, then preferably deposit on the high energy region of the matrix surface, and the nuclei are formed and grow up along the matrix surface with irregular shape; during the latest stages, coatings morphology changes from irregular shape into regular nodules shape gradually with the P content increasing, resulting into the mirror-like amorphous alloy coatings formed.

关 键 词：化学镀 Ni—Cu—P合金 沉积过程 优先沉积 非晶态镀层 

分 类 号：TQ153.1[化学工程—电化学工业]