氰基苯并噁嗪/环氧树脂共混体系的性能研究  

Study on the properties of phenylnitrile functional benzoxazine/epoxy resin blends

作　　者：潘光艳[1] 任皓[1] 齐会民[1] 庄元其[1] 黄发荣[1] 杜磊[1] 

机构地区：[1]华东理工大学材料科学与工程学院,超细材料制备与应用教育部重点实验室,上海200237

出　　处：《化工新型材料》2008年第11期81-83,93,共4页New Chemical Materials

摘　　要：采用三种带有氰基的苯并噁嗪（Ben）与环氧树脂（E51）共混,制备了Ben/E51共混体系。用红外光谱研究了Ben/E51共混体系的固化行为。利用TGA和DMA研究了Ben/E51固化物的耐热性能和动态力学性能,结果显示,共聚体系的分解温度与用酸酐或胺固化的环氧树脂相比提高了70-80℃,玻璃化转变温度提高了30-70℃。Ben/E51共混体系的力学性能和介电性能比苯并噁嗪树脂有明显提高。Three kinds of phenylnitrile functional benzoxazine （Ben） were mixture with epoxy （ES1） to prepare the Ben/ES1 blends and the curing behavior of them was investigated by FTIR. The thermal stability and dynamic mechanical properties of cured blends were studied by TGA and DMA. The results showed that the decomposition temperature of cured blends went up by 70-80℃, and the Tg went up by 30-70℃ compared to epoxy resin cured with anhydride or aniline. The flexural strength, toughness and dielectric property improved apparently compared to polybenzoxazine.

关 键 词：苯并噁嗪 环氧树脂 氰基 耐热性能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]