CSP结构的热应力分析  

Analysis of thermal stress of CSP structure

作　　者：孙炳华[1] 

机构地区：[1]南通大学理学院,南通226007

出　　处：《信息技术》2008年第11期46-48,52,共4页Information Technology

摘　　要：利用ansys软件通过仿真得到了在稳态情况下的CSP结构热场分布,在此基础上,把稳态情况下的热场分布作为温度载荷施加到模型上,得到了CSP结构热应力分布,这对集成电路热设计方案的选择,尤其对提高大功率集成电路的可靠性具有重要意义。In this paper, the thermal distribution of the CSP structure is simulated under the equilibrium state with the ansys software, and by applying the thermo-distribution under the equilibrium state to the model, the thermal stress distribution of the CSP is obtained, this is significant to choosing a suitable thermo-package design of integrated circuit （IC）, especially to improving the reliability of high power IC.

关 键 词：热建模 CSP结构 热应力 

分 类 号：TN305.94[电子电信—物理电子学]