强流脉冲电子束热障涂层表面改性温度场数值模拟  

Simulation of Temperature Field in Surface Modification of Thermal Barrier Coating Deposited by High Current Pulsed Electron Beam

作　　者：宋振飞[1] 秦颖[1] 郝胜智[1] 武洪臣[2] 吴平生[1] 董闯[1] 马腾才[1] 

机构地区：[1]大连理工大学三束材料改性国家重点实验室,大连116024 [2]北京航空制造工程研究所,北京100024

出　　处：《真空科学与技术学报》2008年第6期522-525,共4页Chinese Journal of Vacuum Science and Technology

基　　金：国家863项目资助(No.2006AA03Z110);辽宁省创新团队项目资助

摘　　要：采用了一维温度场模型,对强流(10 A.cm-2~40 A.cm-2)、脉冲时间(10μs^100μs)、电子束辐照热障涂层过程中的温度场进行了数值模拟。模拟结果显示:靶材表层迅速熔化(甚至汽化),熔化层深度达到2.34μm(汽化层深度0.12μm);温度随时间变化率高达107K.s-1~108K.s-1,温度梯度大约109K.m-1;模拟结果与实验结果基本吻合。实验结果表明:经强流脉冲电子束轰击后,热障涂层性能得到改善,有利于热障涂层在工业中的应用。The time evolution of the temperature field in surface modification of thermal barrier coating, deposited by high current （50 A-200 A）,pulsed electron beam （pulse width of 10μs-200μs）,was simulated with the one dimension model. The simulated results show that the target surface melts or vaporizes rapidly, with the melting and/or vaporizing depths of 2.34 pan and 0.12μm,respectively.The temperature rises up at a rate up to 10^7K·s^-1-10^8K·s^-1,with an approximated temperature gradient of 10^9K·m^-1. The simulated results agree fairly well with the experimental observation. We propose that the high current pulsed electron beam technique works very well in surface modification of the thermal barrier eoatings on industrial scale.

关 键 词：强流脉冲电子束(HcPEB) 热障涂层(TBCs) 数值模拟 晶粒细化 

分 类 号：O482.2[理学—固体物理] O241.82[理学—物理]