封套的光热环境与表面热流影响因素分析  

Light thermal environment and surface heat current analysis of envelope

作　　者：易建政[1] 梁波[1,2] 

机构地区：[1]军械工程学院静电与电磁防护技术研究所 [2]中国人民解放军第72478部队

出　　处：《河北工业科技》2008年第6期346-348,351,共4页Hebei Journal of Industrial Science and Technology

摘　　要：从封套所处的光热环境出发,介绍了封套与环境之间几种典型的热量交换形式,包括:太阳辐射、大气逆辐射、地面的热反射与热辐射,以及封套表面的对流换热等。在合理假设的基础上,构建了封套传热的数学模型,分析了几种主要因素对封套表面热流密度的影响。研究结果对弹药等的野外储存具有一定的指导意义。Several kinds of heat exchange between envelope and environment were introduced, such as sun radiation, air athwart radiation, heat echo and radiation of ground and heat convection on envelope surface. Based on some proper assumptions, the mathematic model of heat-transmit was constructed, and the equations of heat current density on envelope surface were established. The effect of several kinds of factors on heat current was analysed. The result had some instructional meaning to the field storage of ammunition.

关 键 词：封套 光热环境 热流密度 数学模型 

分 类 号：TB487[一般工业技术—包装工程] TB485.5