基于MEMS技术的介质隔离压力传感器工艺研究  

Dielectric Isolation Pressure Sensor Processing Study Based on MEMS Technology

作　　者：郭源生[1] 

机构地区：[1]天津大学,天津300072

出　　处：《仪表技术与传感器》2008年第11期18-19,31,共3页Instrument Technique and Sensor

摘　　要：运用MEMS工艺技术制作的敏感元件和介质隔离特殊封装工艺,研制出压力传感器。在腔体内置填充架、充油位置、波纹膜结构等进行了技术创新,使产品的过滤脉冲压力、抗过载和温度系数具有一定的提高。并就创新点对参数影响等特征进行相关论述。This paper applied MEMS processing technology to make sensor component and special dielectric isolation packaging process, developed pressure sensor; and produced several technical innovations on cavity inner filling frame, oil filled location and corrugated diaphragm, which improved produet＇s filter pulse pressure, anti-over loading, and temperature factor. The pa- per also discussed the features of how the innovation influences parameters.

关 键 词：MEMS工艺技术 敏感元件 介质隔离 生产工艺 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]