激光固化快速成形SL7510型光敏树脂性能研究  

Study on the Properties of SL7510 Type Photosensitive Resin for Laser Curing Rapid Prototyping

作　　者：黄笔武[1] 陈伟凡[1] 谌伟庆[1] 

机构地区：[1]南昌大学材料科学与工程学院,江西南昌330031

出　　处：《光学学报》2008年第12期2354-2358,共5页Acta Optica Sinica

基　　金：国家863计划(2002AA6Z3083)资助项目

摘　　要：利用红外光谱仪、紫外激光固化快速成形设备、旋转黏度计、电子拉力试验机以及热机械性能分析仪对美国Huantsman公司的SL7510型光敏树脂进行了性能研究。实验结果表明,SL7510型光敏树脂是一种环氧树脂-丙烯酸酯混杂型光敏树脂,它在30℃时的黏度为335mPa.s,临界曝光量为10.9mJ/cm2,透射深度为0.14mm,固化体积收缩率为4.03%,固化物拉伸强度为40.8MPa,拉伸弹性模量为2009.2MPa,断裂伸长率为13.6%,玻璃化温度为62℃。同时,根据所测定的光敏树脂临界曝光量和透射深度数值,选定了紫外激光固化快速成形设备的加工参数,制作了电话机外壳,其制作效果较好。The properties of Huntsman SL7510 type photosensitive resin spectrometer, a stereolithography apparatus, a spinning viscometer, were investigated by using a FT-IR a universal testing machine and a thermomechanical analysis meter. The experimental results showed that the photosensitive resin belongs to an epoxyacrylic hybrid photosensitive resin, its viscosity at 30 ℃ is 335 mPa · s, its critical exposure （Ec） is 10.9 mJ/cm^2 , its penetration depth （Dp） is 0.14 mm, its cured volumetric shrinkage is 4.03 %, the tensile strength of its cured product is 40.8 MPa, the tensile modulus of its cured product is 2009.2 MPa, the elongation at break of its cured product is 13.6 %, and the glass transition temperature of its cured product is 62 ℃. According to the determined Ec and Dp values of the photosensitive resin, the processing parameters of the stereolithography apparatus were chosen to fabricate the part of a telephone shell, and the quality of the fabricated part was good.

关 键 词：激光技术 快速成形 光敏树脂 临界曝光量 透射深度 

分 类 号：TN249[电子电信—物理电子学]