孔洞平板玻璃钢化及承载仿真模拟  

Simulation of the Tempering and Load-bearing Process of Glass Plate with Holes

作　　者：夏国华[1] 朱锦杰 童树庭[1] 

机构地区：[1]同济大学材料科学与工程学院,上海200092 [2]上海耀华-皮尔金顿汽车玻璃有限公司,上海201315

出　　处：《玻璃与搪瓷》2008年第6期1-5,共5页Glass & Enamel

摘　　要：用非线性有限元分析方法,建立了玻璃的热粘弹性应力松弛数学模型、Narayanaswamy结构松弛数学模型,对带孔洞平板玻璃钢化过程进行三维仿真模拟,得到玻璃孔洞周围的应力分布。再把孔洞玻璃板的钢化应力场的最后结果作为初始应力状态导入拉伸模型中,进行孔洞玻璃承载仿真模拟,结果表明孔洞为最先破裂部位。模拟结果有助于在实际钢化生产中采取相应针对性工艺措施,提高玻璃孔周围的残余压应力,增强玻璃强度。Three dimensional thermal tempering of glass sheet with holes has been simulated by using the non -linear FEM. Numerical model for stress and structural relaxation has been established during the simulation based upon the theory of thermo - viscoelasticity and Narayanaswamy＇s structural relaxation of glass respectively. Residual stress distribution around the holes of the glass plate was obtained, which is useful for improving product quality. The result of the residual stress dietribution of the glass plate was then input into the tension model as the data of initial condition so as to simulate load -bearing process. The data from the simulation show that the first crack appeared near the hole. This simulation is helpful for adopting corresponding appropriate technological measurements during tempering process so as to enhance residual stress around the hole of the glass plate, and therefore, increase the glass strength.

关 键 词：玻璃 钢化 数值模拟 应力 

分 类 号：TQ171.114[化学工程—玻璃工业]