粘接低表面能材料时α-氰基丙烯酸酯胶粘剂用底胶的研究  

Study on primer of α-cyanoacrylate adhesives for low surface energy substrate bonding

作　　者：王灿[1] 刘秀生[1] 高万振[1] 

机构地区：[1]武汉材料保护研究所,湖北武汉430030

出　　处：《粘接》2008年第12期24-26,共3页Adhesion

摘　　要：研究了底胶在α-氰基丙烯酸酯胶粘剂粘接低表面能材料时的作用。底胶中三苯基膦、添加剂N99可以大幅提高低表面能材料与α-氰基丙烯酸乙酯胶之间的粘接强度。The primer compositions for bonding tow surface energy materials with α-cyanoacrylate were studied. Triphenylphosphine and additive N99 in the primer can drastically increas the bonding strength between ethyl α-cyanoacrylate adhesive and low surface energy materials.

关 键 词：低表面能材料 Α-氰基丙烯酸酯胶粘剂 底胶 

分 类 号：TQ433.436[化学工程]