苯乙炔基封端聚酰亚胺树脂的固化动力学研究  

The curing kinetics of phenylethynyl terminated polyimide

作　　者：程晓君[1,2] 陈永军[1,2] 余瑞链[2] 冯志海[2] 徐樑华[1] 

机构地区：[1]北京化工大学材料科学与工程学院,北京100029 [2]航天材料工艺研究所先进功能复合材料技术国防科技重点实验室,北京100076

出　　处：《化工新型材料》2008年第12期59-61,共3页New Chemical Materials

基　　金：装备预先研究项目(51312010804)

摘　　要：采用非等温差示扫描量热法(DSC)研究了两种苯乙炔基封端型聚酰亚胺树脂固化动力学过程,分析了不同升温速率下,两体系的特征固化温度,反应热及反应速率与温度的关系。运用Kissinger法和Melak法进行数据处理。结果表明:(1)苯乙炔封端型聚酰亚胺树脂的固化过程符合n级固化反应方程,建立的固化反应方程较好地描述了其固化过程,且与实验数据拟合结果较好。(2)两树脂体系相比,分子链柔性较大的聚酰亚胺树脂特征固化温度较低,固化温区较宽,固化反应活化能较低,且反应级数较大。Curing process of two kinds of phenylethynyl end-capped terminated polyimide resins were studied by non-isothermal DSC at different scanning rates. Kissinger and Melak methods were applied to processing the data. The results showed that： （1）the cure kinetic model of phenylethynyl end-capped polyimide resins conform to n-order curing model. The kinetic models calculated well described the curing process and resulting fits were in a good agreement with the experimental data. （2） the resin which had more flexible chains exhibited lower activation energy, characteristic temperatures, wider curing range and larger reaction order.

关 键 词：苯乙炔基 聚酰亚胺树脂 DSC Melak法 固化动力学 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业] TQ323.5