多元合金等温凝固相场法模拟  

Simulation of isothermal solidification of multi-component alloys with phase-field method

作　　者：王智平[1,2] 张殿喜[1] 石可伟[1] 朱昌盛[1] 冯力[1] 肖荣振[1] 

机构地区：[1]兰州理工大学材料科学与工程学院,甘肃兰州730050 [2]兰州理工大学甘肃省有色金属及复合材料工程技术研究中心,甘肃兰州730050

出　　处：《兰州理工大学学报》2008年第6期1-4,共4页Journal of Lanzhou University of Technology

基　　金：教育部博士点基金(20070731001)

摘　　要：利用由二元合金相场模型扩展获得的多元合金相场模型,以Fe-C-P合金为例,研究界面厚度对枝晶生长的影响.结果表明,随着界面厚度的减小,枝晶生长速度增大,界面推进速度提高,主枝晶臂变细,二次枝晶臂越发达,固液界面溶质扩散层的厚度减小,界面前沿溶质分配系数增大,而界面前沿溶质偏析程度也相应增大;相反,随着界面厚度的增加枝晶尖端生长速度逐渐减小,并呈收敛的趋势.By using the phase-field model of multi-component alloys generalized from that of binary alloys and taking Fe-C-P alloy as an example, the influence of interface thickness on dendrite growth of alloys was investigated. The result indicated that, with the decreasing of the interface thickness, the growth velocity of dendrite, and the propagation velocity of interface were increased, and the main arms of the dendrite became thin, its secondary arms became flourished, the thickness of diffused layer of the solute between solid and liquid was decreased, the partition coefficient of the solute in front of the interface was increased, and the solute degree of a liquation in front of the interface was accordingly increased. On the contrary, with the increasing of the interface thickness, the growth velocity of dendrite tip would gradually decrease, showing a trend of convergence.

关 键 词：相场法 多元合金 等温凝固 界面厚度 

分 类 号：TG244[金属学及工艺—铸造] TG248