基于偏振耦合的千瓦级半导体激光加工系统  

Polarization coupling KW laser diode processing system

作　　者：尧舜[1] 曹银花[1] 丁鹏[1] 苏国强[1] 张辉[1] 王智勇[1] 

机构地区：[1]北京工业大学激光工程研究院国家产学研激光技术中心,北京100124

出　　处：《激光杂志》2008年第5期58-59,共2页Laser Journal

摘　　要：根据商用大功率半导体激光堆的偏振性和慢轴远场特性,结合商用光学设计软件ZEMAX将两个600W的半导体激光堆利用Glan-Taylor棱镜进行偏振耦合并准直聚焦输出配以自制加工头获得激光加工系统。系统输出功率大于1000W,在焦距100mm处光斑大小约为1mm×6mm(能量大于95%),平均能量密度大于1.6×104W/cm2。利用该激光系统对U74钢轨的表面以1050mm/min进行扫描,获得表面相变硬化层深度约为0.25mm,表面硬度从250 HV10/20提高到800HVl0/20至900HV10/20。A high power diode laser processing system whose output power is higher than 1KW is presented.In this system,two diode laser stacks（600W/stack） are polarization coupled with Glan-Taylor prism according its polarization characterization and far field characterization in the slow axis by using commercial optical program ZEMAX.Beam s cross section is about lmm ×6 mm（energy 〉95%） at the position of focus length 100mm and the average irradianee is higher than 1.6×104W/cm^2.The U74 steel surface hardness is increased from - HV250 tu HV850 - H900 with thickness of 0.25mm after using presented laser diode system scanning with velocity of 1050mm/min.

关 键 词：半导体激光器 偏振耦合 激光加工 表面处理 

分 类 号：TN365[电子电信—物理电子学]