镁合金表面化学镀Ni-P合金稳定剂优选试验研究  被引量:3

Study on Stabilizers for Electroless Ni-P Alloy on Magnesium Alloy Surface

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作  者:沟引宁[1] 黄伟九[1] 冯旺[1] 薛燕[1] 

机构地区:[1]重庆工学院材料科学与工程学院,重庆400050

出  处:《热加工工艺》2008年第24期74-77,共4页Hot Working Technology

基  金:重庆市教委科技研究资助项目(KJ070602);湘潭大学低维材料及其应用技术教育部重点实验室开放基金资助项目(KF0604)

摘  要:在合理选择化学镀Ni-P合金配方和工艺条件的基础上,采用对比实验研究了硫脲、Pb(AC)2、KIO3、KI、Bi(NO3)2几种稳定剂及其复合对镁合金化学镀Ni-P合金镀液及镀层性能的影响。研究发现:适合NiSO4体系镁合金化学镀的稳定剂为KI+KIO3,采用复合稳定剂的镀液稳定性及镀层性能明显优于单一稳定剂,在优化的稳定剂及相应的工艺条件下,镀液的稳定性好,镀速高,镀层均匀、致密,孔隙率低,耐蚀性能优良。Based on reasonable prescription and technology of electroless Ni-P plating on magnesium alloy, the effects of stabilizers in plating solution, such as thiourea, Pb (AC)2, KIO3, KI, Bi (NO3)2 on the properties of plating coating were studied by contrast experiment. The results show that the stabilizer adapting to electroless on magnesium alloy using NiSO4 as the main salt is KI+KIO3. The stability of electroless solution and properties of Ni-P coating with the binary stabilizers are superior to those with the single stabilizer. Under the condition of optimum stabilizer and technology, the bath solution is stable. The deposition rote is fast and the obtained plating coating has advantages such as uniform layer, high density, low porosity and good corrosion resistance.

关 键 词:镁合金 化学镀NI-P 稳定剂 

分 类 号:TG174.445[金属学及工艺—金属表面处理]

 

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