TiN_P/Cu复合材料的原位渗氮法制备及性能研究  

Study on fabrication and properties of TiN_P/Cu composites by means of in situ nitridation process

作　　者：刘德宝[1] 陈民芳[1] 沈荣臻[1] 崔春翔[2] 

机构地区：[1]天津理工大学材料科学与工程学院,天津300191 [2]河北工业大学材料科学与工程学院,天津300293

出　　处：《材料热处理学报》2008年第6期9-13,共5页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(50471048);天津高等学校科技发展基金(20060904)

摘　　要：对Cu-Ti合金原位渗氮法制备TiNP/Cu复合材料进行试验研究。结果表明:可以通过高能球磨制备亚稳态Cu-Ti合金粉,然后渗氮的方式制备TiNP/Cu复合材料。将Cu-Ti混合粉球磨48h后Ti的结构特征已不存在,形成一种亚稳态的Cu-Ti合金粉,经950℃二次渗氮后形成Cu-TiN合金粉末。将Cu-TiN合金粉末压制烧结后与外加法制备的TiNP/Cu复合材料性能对比表明:采用原位渗氮法制备TiNP/Cu复合材料具有较高的密度、硬度以及拉伸强度,但电导率低于外加法制备的TiNP/Cu复合材料。Theoretical analysis and experiment research were carried out for fabricating TiNp/Cu composites by means of in situ nitriding process from Cu-Ti alloy powder system. The results show that the metastable Cu-Ti composite powders is obtained by high energy ball milling and then the TiNp/Cu composite powders are successfully prepared by nitriding the Cu-Ti composite powders at 950℃ . As compared the TiNp/Cu composites fabricated by pressing and sintering Cu-TiN composite powders with the TiNp/Cu composites fabricated by conventional powder metallurgy process, the former exhibits higher density, hardness and lower electrical conductivity.

关 键 词：TIN 铜基复合材料 渗氮 制备 性能 

分 类 号：TG156.82[金属学及工艺—热处理] TB33[金属学及工艺—金属学]