新型SMT/THT混装焊接技术概述  

Summary of New Soldering Technology for SMT/THT Mixed Production

作　　者：鲜飞[1] 

机构地区：[1]烽火通信科技股份有限公司,湖北武汉430074

出　　处：《印制电路信息》2009年第1期60-64,共5页Printed Circuit Information

摘　　要：电子组装的高密度给传统波峰焊接技术提出了新挑战。为了应对挑战,新的混装焊接技术不断涌现。与传统波峰焊情况不同,这些新型焊接技术可以保护表面贴装元件来实现对通孔元件焊接,大幅度降低生产工序和周期时间,印刷线路板的焊接质量也被提升。新的焊接工艺允许充分有效利用SMT贴装设备,消除对点胶机的使用。文章主要介绍了几种新型混装焊接技术的特点,可以确信这些新型焊接技术将会被更多地应用于电子组装上,并将非常具有竞争力。The high density of electronics assembly has already bring up the new challenge to conventional wave soldering technology. For replying challenge, the new soldering technology for SMT/THT mixed production continuously appears. They allowed through-hole components to be soldered, and protected the SMT components from the wave, unlike in the case of wave soldering. Cycle time and labor content were greatly reduced by selective soldering. Soldering quality of the PCB was also improved. The soldering procedure allowed for efficient use of the SMT placement equipment and eliminated the use of adhesive application machines. Characteristics of several advanced soldering technology are introduced in the paper. It is believed that they will more be adopted in electronics assembly, and will also be a competitive soldering technology.

关 键 词：通孔回流焊 选择性焊接 印制电路板 波峰焊 电子组装 

分 类 号：TN305.94[电子电信—物理电子学]