等离子烧结与等离子活化烧结  

Plasma Sintering and Plasma Activated Sintering

作　　者：李汶霞[1,2] 鲁燕萍[1,2] 果世驹[1,2] 

机构地区：[1]北京科技大学 [2]北京真空电子技术研究所

出　　处：《真空电子技术》1998年第1期17-23,共7页Vacuum Electronics

摘　　要：等离子烧结具有烧结速率极快、烧成温度高以及能量利用效率高等优点而成为新一代很有潜力的烧结工艺。本文对等离子烧结的发展与现状及其工作机理进行了综述。等离子烧结用于陶瓷及其复合材料尚处于起步阶段，但它必定会成功地用于新材料的制备。Owing to the extremely rapid rate of sintering , high temperature and very high energy efficiency ,the plasma sintering is becoming one of the most potential material processing technology of the next generation. In this paper ,therefore ,the development ,the state-of -art and the mechanism of plasma sintering have been reviewed and discussed. Plasma sintering of ceram- ic and composite materials is still at the infancy stage. However , it is inevitable that the plasma sintering would be successfully applied for processing new materials.

关 键 词：等离子烧结 等离子活化烧结 烧结工艺 

分 类 号：TF124.52[冶金工程—粉末冶金]