环氧灌封材料的研究进展  

Research Progress in Epoxy Encapsulating Materials

作　　者：白战争[1,2] 赵秀丽[2] 罗雪方[1,2] 罗世凯[2] 刘勇[1,3] 

机构地区：[1]中国工程物理研究院化工材料研究所,绵阳621900 [2]西南科技大学材料科学与工程学院,绵阳621010 [3]中国人民解放军96411部队,宝鸡721006

出　　处：《材料导报》2009年第1期24-27,共4页Materials Reports

基　　金：中国工程物理研究院科学技术发展基金资助项目(2007B03003)

摘　　要：环氧树脂作为当前应用最广泛的灌封材料之一,具有优异的介电绝缘性能、热学性能和粘接性能,成型工艺简单,粘度低,优良的耐化学、湿、腐蚀性能,低固化收缩率等优点。针对环氧树脂脆性大的缺点,综述了环氧灌封材料的几种增韧方法,主要包括橡胶、核-壳结构聚合物、热塑性树脂、液晶聚合物和无机刚性粒子增韧,并介绍了环氧灌封材料的应用研究进展,最后展望了环氧灌封材料的发展趋势和前景。Epoxy resins as a most widely used class of encapsulating materials has many merits; good dielectric behavior,thermal characteristics and bonding performance, easily molding technics, low viscosity, outstanding resist ance to chemicals , moisture and corrosion, low shrinkage during cure and so on. Due to the brittleness of epoxy resin, several different toughening methods for epoxy encapsulating materials are reviewed, which include rubber, core-shell latex polymer, thermoplastic resin , liquid crystal polyester, inorganic rigid particles toughening. The latest application research progress of epoxy encapsulating materials is introduced in the paper. Lastly, the development trend and prospect of epoxy encapsulating materials are investigated.

关 键 词：环氧树脂 灌封 增韧 应用 进展 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业] TQ433.437