倒装焊器件返修工艺  

Flip-chip Device Rework Technologies

作　　者：贾小平 任博成 

机构地区：[1]北京装联电子工程有限公司,北京100041

出　　处：《电子工艺技术》2009年第1期29-31,共3页Electronics Process Technology

摘　　要：在焊接过程中,返修工作始终是其必不可少的一个组成部分。根据多年来SMT生产实践经验,针对目前倒装焊器件的种类,简单介绍了FC器件焊接故障定位的三种方式及加热焊接设备再流焊炉、返修台、热风枪的选用原则,详细介绍了倒装焊器件重新加热、拆植焊、拆焊、特殊返修四种返修工艺方法,可供有关人员参考。Electronic Packaging that flip -chip technology applied more widely has many advantages, for example ,high -density ,high speed signal processing,small parasitic capacitance/inductance and so on. The soldering technology is more difficult than other packages because of its array solder joint under the device are not visible. According to many years practical experience in the production of SMT, summarize three ways for FC devices soldering. The selection principle of the soldering equipment is introduced including reflow oven, rework station, hot air gun, and the four flip - chip device rework process methods are also introduced in detail, including re - heating,removing planting and soldering,removing and soldering, special rework.

关 键 词：倒装器件 故障诊断 加热焊接设备 FC器件返修 

分 类 号：TN605[电子电信—电路与系统]