邻苯二甲酸二丙烯酯的固化及其反应动力学  

Curing reaction and its kinetics of diallyl orthophthalate resin

作　　者：徐莎[1] 梅启林[1] 黄志雄[1] 黎江[1] 

机构地区：[1]武汉理工大学材料科学与工程学院,湖北武汉430070

出　　处：《热固性树脂》2009年第1期13-16,共4页Thermosetting Resin

摘　　要：利用FTIR研究丁邻苯二甲酸二烯丙酯（DAOP）在高温条件下的固化反应，采用DSC研究确定了2，3-二甲基-2，3-二苯基丁烷（DMDPB）／邻苯二甲酸二烯丙酯（DAP）体系的固化行为及其动力学参数。结果表明：DMDPB可在180～210℃下引发DAOP树脂的固化反应，且体系固化过程中放热平缓；DMDPB用量为2％时，体系的凝胶温度、固化温度、后处理温度分别为：173．19℃、195．72℃、209．20℃；其表观活化能为93．488kJ／mol，反应频率因子为1．02×10^10，表观反应级数为O．9223。Curing reaction of diallyl orthophthalate （DAOP） resin at high temperature was studied by FTIR.The curing behavior and kinetic parameters of 2, 3 - dimethyl -2, 3 - diphenylbutane （DMDPB）/ diallyl orthophthalate （DAOP） curing system were determined by DSC. The results indicated that DAOP resin curing reaction could be initiated at 180 - 210 ℃ in the presence of DMDPB and the heat release was gentle in the curing process. The gel - temperature, curing temperature and post - curing temperature of the system with 2% DMDPB was 173.19 ℃, 195.72℃, and 209.20℃ respectively.The apparent activation energy was 93.488 kJ/mol. The frequency factor was 1.02×10^10 and the reaction order was 0.9223.

关 键 词：邻苯二甲酸二丙烯酯 固化 动力学参数 

分 类 号：TQ323.42[化学工程—合成树脂塑料工业]