废旧酚醛树脂印刷电路板的热解特征  

PYROLYSIS CHARACTERISTIC OF WASTE PHENOLIC-RESIN-BASED PRINTED CIRCUIT BOARDS

作　　者：周文贤[1] 陈烈强[1] 关国强[1] 

机构地区：[1]华南理工大学,传热强化与过程节能教育部重点实验室,广州510640

出　　处：《环境化学》2009年第1期99-102,共4页Environmental Chemistry

基　　金：广东省科技重点计划项目(2006A36703001);广州市科技计划项目(2006J1-C0431)．

摘　　要：采用热重差热联用分析仪研究了废旧酚醛树脂电路板的热解特征,结果表明,热失重曲线有两个主要快速失重阶段(270℃—350℃,350℃—480℃),通过裂解气相谱质谱联用仪分析其主要裂解产物为苯酚、溴酚、二氧化碳、对甲苯酚、邻异丙烯基苯酚、邻甲苯酚、对异丙基苯酚、糠醛等.Pyrolysis characteristics of waste phenolic-resin-based printed circuit boards （PR-WPCBs） have been studyed by thermogravimetry and differential scanning calorimetry （TG-DSC）. The reactions in two distinct stages of thermagravimetic process （270℃--350℃, 350℃---480℃） were discussed. In addition, the compositions of pyrolysis products were analysed by pyrolysis gas chromatography mass spectrometry（ Py-GC/ MS ）. The pyrolysis products were mainly composed of phenol, bromophenol, carbon dioxide, 4-methylphenol, p-isopropylenephenol, 2-methylphenol, o-isopropylphenol and furaldehyde.

关 键 词：废旧电路板 酚醛树脂 热解 热失重分析. 

分 类 号：X705[环境科学与工程—环境工程]