不同温度下Cu/FeS复合材料摩擦过程中组织演变的分子动力学模拟研究  

Molecular Dynamics Simulation of the Microstructure Evolution of Cu/FeS Composite in Friction under Different Tempertures

作　　者：洪振军[1] 陈敬超[1] 冯晶[1] 

机构地区：[1]昆明理工大学稀贵及有色金属先进材料教育部重点实验室云南省新材料制备与加工重点实验室,云南昆明650093

出　　处：《摩擦学学报》2009年第1期43-49,共7页Tribology

基　　金：国家科技支撑计划资助重大项目(批准号:2008CB617609);云南省应用基础研究计划资助重点项目(批准号:2006E0003Z)

摘　　要：通过计算机模拟的方法对不同温度下Cu//Cu/FeS摩擦副的摩擦性能进行计算研究,结果发现:当环境的温度在500 K时,摩擦副的摩擦系数出现第一个谷值,而此时金属铜发生再结晶,黏着磨损更为明显;700 K时,黏着层数减小而摩擦系数却有所增大,主要是由于复合材料内部的FeS结构发生转变造成.计算结果还证明:在高温情况下,增强相FeS存在先分解再重新结合的2个过程,并指出Cu/FeS复合材料在900 K时,仍然具有很好的减摩耐磨作用.还对不同温度摩擦时复合材料内部的组织演变过程进行系统分析,分析结果表明,随着温度的升高,FeS的结构发生演变,从六方NiAs型超结构相转变为简单NiAs型结构相,并且随着温度的升高,FeS结构的c/a也在不断减小,这些都影响着复合材料的摩擦性能.Tribological property of Cu//Cu/FeS tribopair under different temperatures was simulated by molecular dynamics. The tribopair exhibited a low value of friction coefficient at 500K, when there was a severe adhesion wear due to recrystallization of Cu. At 700 K, the number of adhesion layers decreased and friction coefficient increased a little, this is because that FeS structured changed. The simulation proved that FeS experienced two processes of decompose and reunite, and Cu/FeS composite exhibited good tribological performance at 900 K. The evolution of structure was analyzed systematically. With increase of temperature, FeS structure changed from hexagonal NiAs- type superstructure to simple NiAs -type phase, and the c/a ratio decreased gradually, which affects the performance of the composite.

关 键 词：复合材料 摩擦磨损 分子动力学 组织演变 摩擦系数 黏着层数 

分 类 号：TB752[一般工业技术—真空技术] TQ174[化学工程—陶瓷工业]