脉冲电沉积Co-W磁性薄膜  

Co-W Magnetic Film Obtained by Pulse Plating

作　　者：余云丹[1] 胡秀坤[1] 卫国英[1] 吴琼[1] 葛洪良[1] 

机构地区：[1]中国计量学院材料科学与工程学院,浙江杭州310018

出　　处：《电镀与环保》2009年第1期16-20,共5页Electroplating & Pollution Control

基　　金：国家自然科学基金资助项目(No.20571067&20601024);浙江省科技计划项目(2006C21103)

摘　　要：采用脉冲电沉积法制备Co-W磁性薄膜。研究脉冲周期和占空比对沉积速率,Co-W薄膜的形貌、结构以及磁性能的影响。结果表明:脉冲周期与占空比对薄膜的沉积速率、形貌、结构和磁性能都有较大的影响。随着脉冲周期和占空比的不断增加,沉积速率呈现先增大后减小的趋势;而Co-W薄膜的矫顽力呈现减小的趋势。这主要是由于晶粒尺寸增大的缘故。AFM研究表明:随着占空比增大,薄膜颗粒增大,表面平整度下降,空隙率增加;脉冲周期影响薄膜表面聚集颗粒团;增大脉冲周期,该聚集团会增大。The Co-W thin magnetic film was prepared by using a pulse plating method. Effects of pulse period and duty ratio on deposition rate as well as the morphology, structure and magnetic properties of the film were investigated. The results show that deposition rate as well as the morphology, structure and magnetic properties of the film are affected by pulse period and duty ratio to a greater extent. With the continuous increase of pulse period and duty ratio, deposition rate tends to increase first and then decrease while the coercivity of the film tends to reduce gradually, mainly due to the increase of grain size. AFM study shows that with the increase of duty ratio, the granules of the film will become bigger, the evenness will be worse and the voidage will increase; pulse period has an impact on the size of granule conglomeration on the film surface, which will become bigger if pulse period is increased.

关 键 词：脉冲电沉积 占空比 脉冲周期 Co—W合金薄膜 

分 类 号：TQ153[化学工程—电化学工业]