导热绝缘高分子复合材料的研究进展  

Research Progress of Thermal Conductive and Dielectric Polymer Composites

作　　者：任芳[1] 任鹏刚[1] 狄莹莹[1] 

机构地区：[1]西安理工大学,西安710048

出　　处：《包装工程》2009年第2期122-124,共3页Packaging Engineering

摘　　要：介绍了导热绝缘高分子复合材料的导热机理及制备方法。论述了导热绝缘高分子复合材料的研究进展,包括导热绝缘填料、导热绝缘橡胶、导热绝缘塑料及导热绝缘胶粘剂的研究。最后阐述导热绝缘复合材料的应用及发展方向。Thermal conducting mechanism and the preparation methods of thermally conductive and dielectric polymer composites were introduced. The research progress in the thermally conductive and dielectric polymer composites was reviewed, including thermal conductive filling, composite plastics, rubbers and adhesives. The applications and development direction of thermally conductive and dielectric polymer composites were also introduced.

关 键 词：导热绝缘 导热机理 复合材料 导热填料 

分 类 号：TM211[一般工业技术—材料科学与工程]