无载合分小电流触头接触电阻增加的机理  

The Mechanisms of Contact Resistance Increase of Electrical Contacts on Making and Breaking Small Currents Under No-Load

作　　者：郭凤仪[1] 王其平[1] 孙鹤旭[2] 

机构地区：[1]西安交通大学 [2]辽宁工程技术大学

出　　处：《电工技术学报》1998年第1期23-26,22,共5页Transactions of China Electrotechnical Society

基　　金：国家自然科学基金;煤炭科学基金

摘　　要：根据理论分析及实验结果，探讨了无载合分小电流触头接触电阻增加的原因，建立了因触头表面产生污染物而导致接触电阻增加或触头失效的数学模型。Based on the experimental results and theoretical analysis,the reasons of contact resistance increase are discussed on making and breaking small currents under no-load, the math model which contacts failure and contact resistance increase are caused by contaminants formed on contact surfaces is developed in this paper.

关 键 词：接触电阻 污染物 摩擦腐蚀 触头 

分 类 号：TM501.3[电气工程—电器] TM503.5