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作 者:林穗云[1]
出 处:《广东化工》2009年第2期86-89,共4页Guangdong Chemical Industry
基 金:广东省科技计划项目(20006B36703005)
摘 要:电镀和化学镀金镀液中,金的含量对金镀层的质量起决定性的作用。文章采用了两种测定镀金溶液和漂洗液中金含量的测定方法,并对NH4HF2-碘量法的适用下限、稳定剂HCl浓度、镀金液的消解条件及残余硝酸和Pb2+、Cu2+、Fe2+、Co2+、Sb3+等重金属离子,对测定结果的影响作了对比;同时也对改进的分光光度法中金的富集、洗脱液的配比、流速等工艺条件进行了对比试验,为金的准确快速测定提供实验依据。In the solution of electroplate and chemical gold plating, the amount of gold plays a chief part in the quality of gold plated. Two methods were used to determine the amount of gold in the solution of gold plating and wash liquid and the influences of the examination results of the applicable minimum of NH4HF2 iodimetry were compared, lodometric concentration of stabilizer HCl, the digesting conditions of gold plated solution's residual nitric acid and heavy metal ions like Pb^2+, Cu^2+, Fe^2+, Co^2+, Sb^3+and etc. Meanwhile, the contrast examination on technological conditions such as the MIBK's enrichment of spectrophotometry formulation of eluent and velocity and etc. had been made. It provided experimental basis for the high- speed test of gold.
分 类 号:TQ153.18[化学工程—电化学工业] X792.03[环境科学与工程—环境工程]
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