TDM仿真电路的封装协议  

TDM Circuit Simulation Wrapping Protocol

作　　者：王帆[1] 布挺[1] 

机构地区：[1]洛阳理工学院,洛阳471003

出　　处：《中国新通信》2009年第3期63-66,共4页China New Telecommunications

摘　　要：TDM电路仿真技术在PWE3框架协议下,采用电路仿真方式,在包交换网络上为PDH和SDH数据流提供端到端的传输。TDM电路仿真业务实现方法是将TDM业务数据用特殊的电路仿真报文头进行封装,在下一代包交换网络中提供TDM业务接入和TDM数据透传能力,这项技术可以使网络上大量存在的TDM设备继续使用,保护用户在TDM设备上已有的投资。本文着重介绍几种TDM电路仿真封装协议SAToP协议、CESoPSN协议,使读者能对该项技术有一个概括的掌握。The simulation technology of TDM circuit lies on the PWE3 protocol, and provides the way to transfer PHD and SDH dataflow end-to-end in packet switching network with circuit simulation. The realization of TDM simulation service is wrapping the TDM service data by the specific circuit simulation message header. In the next-generation packet-switched TDM networks to provide access to business data and TDM-through capacity, The technology allows the existence of a large number of network equipment to continue to use the TDM, to protect users on the existing investment of TDM equipment. We will focus on some TDM circuit simulation wrapping protocol SAToP and SESoPSN and give a general introduction.

关 键 词：TDM 电路仿真 封装协议 SAToP CESoPSN 

分 类 号：TN915.04[电子电信—通信与信息系统]