KH-560改性CE/nano-SiC复合材料的韧性和耐热性  

Tenacity and Heat Resistance of CE/nano-SiC Composites Modified with KH-560

作　　者：张学英[1] 张文根[1] 祝保林[1] 王君龙[1] 梁国正[2] 

机构地区：[1]渭南师范学院复合材料研究所,陕西渭南714000 [2]西北工业大学理学院,陕西西安710072

出　　处：《材料开发与应用》2009年第1期1-3,共3页Development and Application of Materials

基　　金：陕西省自然科学基金项目(2006B25);渭南师范学院科研基金项目(08YKF016)

摘　　要：采用模塑成型法制备CE/nano-SiC复合材料,通过冲击强度测试、TGA分析和DMA分析,发现偶联剂KH-560表面处理nano-SiC后,对其韧性和耐热性具有显著的协同改性作用。相对纯CE,经KH-560表面处理后的CE、1.00%nano-SiC复合材料,冲击强度提高86.26%;玻璃化转变温度提高16.71%;失重5%时,热分解温度提高17.25%;450℃时,质量保持率提高59.67%。The CE/nano-SiC composites were made by moulding method. It was discovered that the tenacity and heat resistance of the composites were improved when the reinforcement nano-SiC was treated with coupling agent KH-560 in coordination by discussion of impact strength, TGA and DMA. Compared with CE without nano-SiC, the impact strength of the CE composite with 1.00% KH-560 treated nano-SiC increased by 86.26%, and the increase of the glass transition temperature was 16.71%. When the mass loss of composites was 5%, the heat-degradation temperature increased by 17.25%. And the quality maintaining rate increased 59.67% when its temperature was 450℃.

关 键 词：氰酸酯树脂 偶联剂 NANO-SIC 改性研究 

分 类 号：TB332[一般工业技术—材料科学与工程] TQ325[化学工程—合成树脂塑料工业]