应力对Ag颗粒增强SnCu基复合钎料蠕变性能的影响  

The influence of stress on creep behavior of Ag particle enhancement SnCu based composite solder

作　　者：闫焉服[1] 徐健[2] 郭晓晓[1] 冯丽芳[1] 赵培峰[1] 

机构地区：[1]河南省有色金属材料科学与加工技术重点实验室,洛阳471003 [2]中国船舶重工集团公司第七二五研究所,洛阳471039

出　　处：《材料研究学报》2009年第1期69-72,共4页Chinese Journal of Materials Research

基　　金：“十一五”国家科技支撑计划2006BAF04B14;河南省科技攻关072102260016资助项目~~

摘　　要：使用搭接面积为1 mm^2的单搭接钎焊接头,研究了恒定温度下应力对Ag颗粒增强SnCu基复合钎料钎焊接头蠕变寿命的影响,结果表明:Ag颗粒增强SnCu基复合钎料的蠕变抗力优于99.3Sn0.7Cu基体钎料;随着应力的增大,复合钎料及其基体钎料钎焊接头的蠕变寿命均呈下降趋势,且应力对复合钎料钎焊接头蠕变寿命的影响比基体钎料明显.Single shear lap creep specimens were developed using Ag particle-enhancement SnCu based composite solder to examine the influence of stress on creep behavior of the composite solder in this paper. Results show that the creep resistance of solder joints of particle enhancement 99.3Sn0.7Cu based composite solder is superior to that of 99.3Sn0.7Cu solder joints. At the same time, the creep rupture lifetime of the solder joints of the composite solders was decreased with the increasing of stresses and felt down faster than those of 99.3Sn0.7Cu solder joints.

关 键 词：材料科学基础学科 蠕变寿命 复合钎料 应力 

分 类 号：TG425[金属学及工艺—焊接]