Thermal stability of HfTaON films prepared by physical vapor deposition  

作　　者：许高博 徐秋霞 

机构地区：[1]Institute of Microelectronics,Chinese Academy of Sciences

出　　处：《Journal of Semiconductors》2009年第2期21-25,共5页半导体学报（英文版）

基　　金：supported by the State Key Development Program for Basic Research of China (No. 2006CB302704) ;the National Natural Science Foundation of China (No. 60776030)

摘　　要：We investigate the thermal stability of HfTaON films prepared by physical vapor deposition using high resolution transmission electronic microscope （HRTEM） and X-ray photoelectron spectroscopy （XPS）. The results indicate that the magnetron-sputtered HfTaON films on Si substrate are not stable during the post-deposition annealing （PDA）. HfTaON will react with Si and form the interfacial layer at the interface between HfTaON and Si substrate. Hf-N bonds are not stale at high temperature and easily replaced by oxygen, resulting in significant loss of nitrogen from the bulk film. SiO2 buffer layer introduction at the interface of HfraON and Si substrate may effectively suppress their reaction and control the formation of thicker interfacial layer. But SiO2 is a low k gate dielectric and too thicker SiO2 buffer layer will increase the gate dielectric＇s equivalent oxide thickness. SiON prepared by oxidation of N-implanted Si substrate has thinner physical thickness than SiO2 and is helpful to reduce the gate dielectric＇s equivalent oxide thickness.We investigate the thermal stability of HfTaON films prepared by physical vapor deposition using high resolution transmission electronic microscope （HRTEM） and X-ray photoelectron spectroscopy （XPS）. The results indicate that the magnetron-sputtered HfTaON films on Si substrate are not stable during the post-deposition annealing （PDA）. HfTaON will react with Si and form the interfacial layer at the interface between HfTaON and Si substrate. Hf-N bonds are not stale at high temperature and easily replaced by oxygen, resulting in significant loss of nitrogen from the bulk film. SiO2 buffer layer introduction at the interface of HfraON and Si substrate may effectively suppress their reaction and control the formation of thicker interfacial layer. But SiO2 is a low k gate dielectric and too thicker SiO2 buffer layer will increase the gate dielectric＇s equivalent oxide thickness. SiON prepared by oxidation of N-implanted Si substrate has thinner physical thickness than SiO2 and is helpful to reduce the gate dielectric＇s equivalent oxide thickness.

关 键 词：HfTaON phvsical vapor deoosition thermal stability interfacial laver 

分 类 号：TN304.055[电子电信—物理电子学]