晶须、片晶、颗粒增韧陶瓷技术  

Advancement of Toughening Ceramies with Whisker ,Platelets and Particles

作　　者：高勇[1] 陈森凤[1] 

机构地区：[1]华南理工大学无机系结构陶瓷研究室,广州510641

出　　处：《材料导报》1998年第3期70-72,69,共4页Materials Reports

摘　　要：讨论了用晶须、颗粒或片晶增韧陶瓷在断裂韧性和强度上的发展。主要集中在通过裂纹尖端后部中裂纹桥接工艺(如摩擦桥接和拔出)的增韧机制。Advances in the development of ceramies toughened with whiskers, particles or platelets are reviewed with primary focus on toughening mechanism by crack bridging process-es (e. g. frictional bridging and pullout) in the wake of the crack tip.

关 键 词：晶须增强陶瓷 片晶增强陶瓷 颗粒增强陶瓷 

分 类 号：TQ174.758[化学工程—陶瓷工业]