含微量Ni、Zr、RE的新型铜基电接触材料组织与性能研究  

Analysis of Microstructure and Properties of Copper-based New Electrical Contact Material With Ni、Zr、RE

作　　者：崔浩[1] 谢明[1] 杨有才[1] 陈永泰[1] 刘满门[1] 张永甲[1] 刘捷[1] 

机构地区：[1]昆明贵金属研究所,昆明650106

出　　处：《电工材料》2009年第1期3-5,9,共4页Electrical Engineering Materials

基　　金：云南省自然科学基金重点项目(2005E0038Q)

摘　　要：在铜基体中添加Ni、Zr、RE微量元素使铜基体合金化,制得新型铜基触头材料。该材料组织均匀,晶粒细小。经过冷加工至0.86 mm时,Ni含量为1%(质量分数,下同)样品的抗拉强度可达600 MPa,硬度HV达158,冷加工性能良好;经过导电性能测试,Ni含量为0.5%样品的相对导电度(IACS)达到75.4%,导电性能良好。New Copper-based electrical contact material is made by alloying copper substrate through adding Ni,Zr,RE. The structure of the material is homogenous and the grain size is small. When the Ni Content is 1wt%, by cold-working at φ0.86mm the tensile strength of the sample is 600 MPa, Vickers hardness is 158. The cold-working properties is good. The result of conductivity＇s test shows that the electrical conductivity of the sample containing Ni 0.5wt% is 75.4% . The conductivity is good.

关 键 词：铜基电接触材料 组织 力学性能 导电度 

分 类 号：TM201.4[一般工业技术—材料科学与工程] TF125.7[电气工程—电工理论与新技术]