一种新型热翅板式电子散热器的模拟研究  

Numerical simulation on thermal performance of a novel brazed heat fin-plate for electronic devices

作　　者：林媛[1] 彭浩[1] 凌祥[1] 

机构地区：[1]南京工业大学机械与动力工程学院,南京210009

出　　处：《机械设计与制造》2009年第3期150-152,共3页Machinery Design & Manufacture

基　　金：教育部新世纪优秀人才支持计划资助(NCET-07-0434)

摘　　要：由于现代电子设备及元器件不断向高集成度、高紧凑性发展,其散热量也不断增大,威胁到其正常工作的安全性和可靠性。为此,一种新型的热翅板式散热器结构被提出,并针对高散热量的电子元件(CPU芯片)进行了散热能力的研究。通过数值模拟分析了该新型散热器的散热性能,得到不同热功率下芯片的温度分布,分析了冷却温度、冷却风量等对散热性能的影响,最终得到了正常工况下的最佳风量。It is known that high degree of electronics integration,high power consumption and com- pactness geuerates higher heat dissipation,. Thus thermal control plays a vital role in the safety and relia-bility of electronic elements and equipment. A novel brazed heat fin-plate（BHFP） was proposed. Based on the CFD simulation,the thermal performance was analyzed under conditions of different airflow volume rates ,temperatures ,density of heat fluxes. The temperature distribution of the chips and the optimal volume rates for different heat fluxes were presented in this work.

关 键 词：电子设备 散热技术 热翅板 数值模拟 

分 类 号：TH16[机械工程—机械制造及自动化]