EACVD小型化系统摆动衬底设计及温度场仿真研究  

Design of Swing Substrate and Study on Temperature Field in Miniature EACVD System

作　　者：王鸿翔[1] 左敦稳[1] 卢文壮[1] 林欢庆[1] 

机构地区：[1]南京航空航天大学,南京210016

出　　处：《中国机械工程》2009年第5期580-584,共5页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(50605032);江苏省自然科学基金资助项目(BK2007193)

摘　　要：对传统的电子辅助化学气相沉积(EACVD)系统连续转动衬底进行改进,设计了无急回特性的曲柄摇杆机构摆动衬底,解决了原衬底结构复杂,只能单点测温,以及衬底冷却水渗漏等问题;对摆动衬底的温度场进行仿真计算,分析了不同摆动参数对衬底温度场的影响,结果表明,选用合适的摆动参数可以获得比较均匀的衬底温度场。仿真结果可以为衬底摆动机构的设计提供理论依据。The existed rotating substrate was improved, and the swing substrate of no--fast--return＇s peculiarity was designed, so as to simplify the substrate structure, measure the temperature of multi--spot on the surface of the substrate and resolve the problem on leakage of cooling water. Finally, the temperature field of the swing substrate was simulated, the influence of various factors, such as swing speed and swing angle, on the temperature field were discussed. The results show that the uniform substrate temperature can be obtained with appropriate swing parameters. The results also provide a basis for the design of swing mechanism of the substrate.

关 键 词：电子辅助化学气相沉积(EACVD)小型化系统 摆动衬底 无急回特性 温度场 

分 类 号：TG174.44[金属学及工艺—金属表面处理] TB43[金属学及工艺—金属学]