仿金镀中超声波的作用  

Action of Ultrasonic Wave in Gold-Imitation Electroless Plating

作　　者：魏小平[1] 陈海钰[1] 李建平[1] 

机构地区：[1]桂林工学院材料与化学工程系,广西桂林541004

出　　处：《材料保护》2009年第3期34-38,共5页Materials Protection

基　　金：教育部科学研究重点项目(207087);广西教育厅科研基金项目(桂教科200508135)资助

摘　　要：超声波在化学镀尤其是仿金镀方面对操作参数、镀层质量作用很大,但其应用报道甚少。为了找出超声波在化学镀中的一般规律,揭示其对仿金电镀中化学镀镍及Cu2+,Zn2+和Sn2+的沉积机理,考察了超声波对仿金镀活化、化学镀镍、仿金镀电镀过程等各阶段多种因素的影响,包括活化工艺、pH值、电流密度、还原剂用量、配位剂用量等;优化了试验条件。结果显示,仿金镀工艺中引入超声波,降低了施镀的温度,提高了仿金镀的沉积速率。最后详细研究了超声波所产生的超声空化等对沉积速率、镀层质量以及仿金镀其他过程的作用机理。A new technology was developed for gold -imitation electroless plating in the presence of ultrasonic irradiation,aiming at improving the quality of the coatings and simplifying the tech-nological processes. The effects of ultrasonic wave on the activa-tion ,electroless nickel plating and copper electroplating subjected to gold-imitation electroless plating process were studied. The op-erating conditions,including deposition temperature,plating time,pH value of solutions,electric current density,concentra-tion of reducing agent,and the amount of coordination agent,were optimized. Moreover,the action mechanism of ultrasonic cavitation on plating rate,properties of coating and other proces-ses of gold-imitation electroless plating were discussed. Results show that ultrasonic irradiation contributed to decrease the plating temperature and increase deposition rate of gold-imitation electro-less plating.

关 键 词：超声波 仿金镀 化学镀镍 电镀 超声空化 作用机理 

分 类 号：TQ153.2[化学工程—电化学工业]