多元铜基活性钎料对c-BN的润湿性与微观组织  

Wettability and microstructure of multicomponent Cu-based active filler metal on c-BN

作　　者：王毅[1,2] 邱小明[1] 卢广林[3] 殷世强[1] 

机构地区：[1]吉林大学材料科学与工程学院,长春130025 [2]长春工程学院机电学院,长春130012 [3]吉林大学地面机械仿生技术教育部重点实验室,长春130025

出　　处：《焊接学报》2009年第2期133-136,共4页Transactions of The China Welding Institution

基　　金：吉林省科技发展计划项目(20070309);长春市科技计划项目(06GJ22)

摘　　要：采用座滴法试验研究了多元铜基活性钎料中Ti,Zr活性元素对c-BN润湿性的影响,借助于扫描电镜(SEM)、能谱分析仪(EDS)和X射线衍射仪(XRD),结合键参数理论分析探讨了多元铜基活性钎料的微观组织,发现钎料主要由Cu固溶体、富Sn相和少量金属间化合物组成.通过计算元素间化学亲和力大小,进一步阐述了多元铜基活性钎料中Ti,Zr活性元素对c-BN润湿性的影响机制.结果表明,多元铜基活性钎料中,添加Ti活性元素比Zr元素更容易润湿c-BN.By using the sessile drop method,the effects of active elements Ti and Zr on the wettability of the multicomponent Cu-based active filler metal on c-BN were studied.With the help of SEM,EDS and XRD,on basis of the key parameters theory,microstructure of the multicomponent Cu-based active filler metal were discussed.It can be found that the filler metal mainly consisted of Cu solid solution,Sn-rich phase as well as a small amount of intermetallic compound.By calculating the relation among the chemical affinity of elements,the influence mechanism of the wettability of the active element Ti,Zr in the multicomponent Cu-based active filler metal on c-BN was further elaborated.The results showed that the wettability of CuNiSnTi active filler metal on c-BN is better than CuNiSnZr.

关 键 词：多元铜基活性钎料 立方氮化硼 润湿性 微观组织 

分 类 号：TG454[金属学及工艺—焊接]