再成形(Re-Balled)焊球阵列封装的焊球强度评估  

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

作　　者：Lei Nie Michael Osterman Michael Pecht Fubin Song Jeffrey Lo S.W. Ricky Lee 

机构地区：[1]Center for Advanced Life Cycle Engineering （CALCE） University of Maryland College Park, MD, USA [2]Electronic Packaging Laboratory Center for Advanced Microsystems Packaging Hong Kong University of Science ＆ Technology Clear Water Bay, Kowloon, Hong Kong

出　　处：《电子工业专用设备》2009年第2期1-5,42,共6页Equipment for Electronic Products Manufacturing

摘　　要：近年来,许多国家禁止在电子产品中铅的使用,但是一些特定产品拥有豁免权。拥有豁免权的电子产品生产厂商面临含铅元器件供应缺乏的现状,因此生产厂商开始寻求利用焊球再成形技术把焊球阵列封装中的无铅焊球转变为锡铅焊球。焊球再成形技术曾经被用于元器件的回收再利用,但是关于焊球再成形元器件的可靠性信息十分有限。介绍了利用焊球再成形技术使无铅焊球阵列封装转变为锡铅焊球阵列封装。两种焊球去除方法和两种焊球再贴装方法分别用于实现从无铅焊球到锡铅焊球的转变,用以调查再成形工艺对于封装质量的影响。热时效试验以及焊球强度评估用于检测焊球再成形工艺过程。Abstract： In recent years, many countries banned the use of lead in select high volume electronic equipment. However, exemptions from lead-free legislation have been granted for certain products. These equipment manufacturers with exemption are facing dwindling supply of lead based parts for their products, and they are looking at reballing lead-flee ball grid array packages with tin-lead solder balls. While reballing has been used for part reclamation, very little information is available on reliability of reballed parts. Two ball removal and two ball attachment techniques were used to change lead-free BGAs in to tin-lead BGAs, in order to determine the effect of different reballing process to the quality of reballed BGAs. Solder attach strength is used to examine the reballing process. The impact of isothermal aging is also examined.

关 键 词：焊球陈列封装 焊球再成型技术 冷却焊端拉力测试 

分 类 号：TN305.96[电子电信—物理电子学]