基于SoC测试系统的RF圆晶片测试技术  

The RF Wafer Test Technology with SoC Tester

作　　者：Advantest Corporation, Advantest(Suzhou) Co., Ltd Suzhou 215021,China 

机构地区：[1]爱德万测试(苏州)有限公司

出　　处：《电子工业专用设备》2009年第3期15-19,共5页Equipment for Electronic Products Manufacturing

摘　　要：以手机为代表的无线通信应用技术已向SiP化发展,因此对构成SiP芯片的各个单元(chip)进行圆晶片级别的测试就必不可少。爱德万测试(ADVANTEST)开发了基于SoC测试系统的RF圆晶片测试解决方案,提供了一系列新技术来解决串扰、电源阻抗和等长布线等课题,从而实现低成本的圆晶片测试。本文将就RF圆晶片级别测试技术及SoC测试系统来介绍该RF圆晶片测试方案。As for the wireless application such as the mobile phone, making to SiP is demanded. Therefore, it is necessary to test the composition chip with the wafer. The solution technology to the problem of the length wiring like crosstalk and the source impedance, etc. was clarified to test the wafer low-cost, and SoC tester RF wafer test solution was developed. In this paper, it introduces the solution technology about the wafer test and the test solution with the SoC tester.

关 键 词：RF 圆晶片测试 SOC测试系统 串扰 同测 低成本 

分 类 号：TN307[电子电信—物理电子学]