XTJ-200旋转涂胶机的研制  

Research of XTJ-200 Spin Coater Equipment

作　　者：赵付超[1] 杜民栋[1] 王卫华[1] 王花[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2009年第3期42-44,共3页Equipment for Electronic Products Manufacturing

摘　　要：XTJ-200旋转涂胶机是电镀法芯片凸点制造过程中的关键设备之一。XTJ-200旋转涂胶机主要是利用离心力的作用使滴在基片上的溶胶凝胶或其他胶液均匀涂在基片上,主要由机架、旋转系统、自动滴胶系统、旋涂盖、热板、加热盖及控制系统等组成。XTJ-200 Spin Coater is one of the key equipment of the electroplating process on wafers. Operated by means of centrifugal force, XTJ-200 Spin Coater dispenses Sol-gel or other glues on the substrate evenly. It is mainly made up of machine frame, revolver, automatic dispensing module, the cover of revolver, heater, the cover of heater, and electric controlling system etc.

关 键 词：旋转 设备 涂胶 基片 

分 类 号：TN305[电子电信—物理电子学]