Ag-Cu-Sn复合电子支架功能材料  

Ag-Cu-Sn Compound Electronic Support Material

作　　者：赵玮霖[1] 郭小燕[1] 孙建[2] 李涛[1] 秦松祥[3] 

机构地区：[1]重庆工学院材料科学与工程学院,重庆400050 [2]重庆机电职业技术学院汽车工程系,重庆400050 [3]泰州职业技术学院机电工程系,江苏泰州225300

出　　处：《热加工工艺》2009年第4期78-80,共3页Hot Working Technology

基　　金：重庆市科技攻关重大项目(CSTC.2005AA3012-1)

摘　　要：通过电刷镀方法在铜带基体上获得钝银和纯锡镀层,从而得到一种新型Ag-Cu-Sn复合电子支架功能材料。采用SEM和EDS方法研究了该功能材料的组织结构和成分,测量了其硬度和厚度,并利用弯曲法和划痕实验法检验了其结合强度和抗剥离性能。结果表明,该功能材料可完全满足作为电子支架材料的要求。The pure silver and the pure tin coating on the copper strip was produced by electronic brush-plating, which a new Cu-Ag-Sn composite functional material for electronic support was obtained. The microstructure and component of the functional materials were examined by SEM and EDS. The hardness and thickness of the coating were tested. The bonding strength between the substrate and coating was also studied. The results show that it can be used as electronic support.

关 键 词：电刷镀 Cu-Ag-Sn 电子支架 功能材料 

分 类 号：TG174[金属学及工艺—金属表面处理] TG146.1[金属学及工艺—金属学]