硫酸–甲醇体系钨电解抛光的可行性研究  

Feasibility of tungsten electropolishing in sulfuric acid–methanol electrolyte

作　　者：宋萍[1,2] 邢丕峰[2] 谌家军[1] 李朝阳[2] 谢军[2] 

机构地区：[1]西华师范大学物理与电子信息学院,四川南充637002 [2]中国工程物理研究院激光聚变研究中心,四川绵阳621900

出　　处：《电镀与涂饰》2009年第3期27-30,共4页Electroplating & Finishing

基　　金：国家高技术研究发展计划

摘　　要：以硫酸–甲醇酸性体系作为电解液,对钨箔进行电解抛光研究。抛光后钨的表面均方根粗糙度和反射率的测试结果表明,该体系完全适用于金属钨的电化学抛光。对钨的阳极溶解行为进行了分析,讨论了溶液组成、槽电压、温度和搅拌速率对电抛光后钨表面粗糙度的影响。初步确定了金属钨电解抛光的工艺参数为:硫酸与甲醇的体积比1∶7,槽电压15～22 V,温度15～25°C,搅拌速率10 m/s。The electropolishing of tungsten was studied in a sulfuric acid-methanol electrolyte. The test results of root mean square roughness and reflectance of the electropolished tungsten foil surface confirmed the feasibility of sulfuric acid-methanol electrolyte to tungsten. The anodic dissolution behavior of tungsten was analyzed. The effects of electrolyte composition, cell voltage, temperature and stirring rate on the surface roughness of electropolished tungsten were discussed. The suitable parameters were preliminarily determined： volume ratio of sulfuric acid to methanol 1：7, temperature 15-25℃, cell voltage 15-24 V, and stirring rate 10 m/s.

关 键 词：钨 电解抛光 表面粗糙度 反射率 

分 类 号：TG580.692.2[金属学及工艺—金属切削加工及机床]