固溶温度对Fe基形状记忆合金性能的影响  

EFFECTS OF SOLUTION TEMPERATURE ON THE PROPERTIES OF Fe-BASED SHAPE MEMORY ALLOY

作　　者：陈淑娟[1] 何国求[1] 张熹[1] 向学渊[1] 胡正飞[1] 

机构地区：[1]同济大学材料科学与工程学院,上海市金属功能材料开发应用重点实验室,上海200092

出　　处：《上海金属》2009年第2期17-20,共4页Shanghai Metals

基　　金：教育部“新世纪优秀人才计划”项目(NCEY-05-0388);紧固件用铁基记忆合金的回复量及相变度的产业化技术攻关(DY06001);上海市金属功能材料开发应用重点实验室开放基金资助项目

摘　　要：研究固溶温度对Fe-Mn-Si-Cr-Ni-Mo合金形状记忆效应的影响,并从合金显微组织结构、层错能和热诱发ε马氏体等几个方面进行了讨论。结果表明,固溶温度大于1173K时,随着温度的升高,奥氏体晶粒度增大,并且应变回复率也降低;固溶温度1173K时,晶粒尺寸最小达45μm,组织中预存的热诱发ε马氏体最少,应变回复率也相对最大。说明热诱发ε马氏体对形状记忆效应不利;合金的层错几率和应变回复率的变化有着一样的趋势,层错几率越大,则合金的回复率也越高。Fe-Mn-Si-Cr-Ni-Mo alloy was homogenized at different temperature to study the effect of homogenization temperature on microstructure and shape memory effect, so did the effects of microstructure, stacking faults and thermal induced ε martensite. The results showed that the grain size of austenite increased and strain recovery rate decreased with the increasing of solution temperature when it is above 1173K. When the alloy was solution treated at 1173K, the smallest grain size was obtained about 45μm as well as the smallest amount of thermal induced ε martensite and largest strain recovery rate. The results revealed that thermal induced ε martensite weakened shape memory effect while stacking faults acted oppositely.

关 键 词：FE-MN-SI形状记忆合金 固溶温度 晶粒尺寸 热诱发ε马氏体 层错 

分 类 号：TG139.6[一般工业技术—材料科学与工程] TG142.33[金属学及工艺—合金]