镁/铝异种材料连接界面的显微组织与结合强度研究  

Study on the microstructure and bond strength of the bonding interface of Mg/Al heterogenous alloy

作　　者：付晓鹏[1] 梁伟[1,2] 李线绒[1] 朱波[1] 王红霞[1] 

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024 [2]新材料界面科学与工程教育部重点实验室太原理工大学,山西太原030024

出　　处：《材料研究与应用》2009年第1期23-27,共5页Materials Research and Application

基　　金：山西省自然科学基金(2006011051);山西省归国留学人员基金(2007-25);山西省大学生创新创业专项基金(07010727);山西省青年科技研究基金(2008021033)

摘　　要：用镁铝共晶合金粉末作为连接剂,分别在420°C和450°C下加压保温一定时间,对AZ91D镁合金与5056铝合金进行了连接.用扫描电子显微镜及配备EDS能谱,对铝、镁合金结合界面的显微组织进行了分析.结果表明,镁铝共晶粉末与两侧基体形成了明显的扩散层,420°C时扩散层由α-Mg+Mg17Al12层、Mg2Al3层、α-Al层组成,450°C时扩散层由Mg17Al12层、Mg2Al3层、α-Al层组成.通过三点弯曲实验对界面结合强度进行测试,结果表明,当450°C下保温90 min时,镁/铝合金连接效果最佳,强度约达27 MPa.AZ91D magnesium alloy and 5056 aluminum alloy were bonded with Mg-AI eutectic alloy inter- layer under constant load in atmosphere at 420 ℃ and 450℃, respectively. The cross-sectional microstructure of the interface was characterised by SEM （equipped with EDS）, the results show that obvious diffu- sion layers are formed. The diffusion layer is composed of α-Mg＋Mg17 Al12, Mg2 Al3 and α-Al sublayers at 420 ℃, while Mg17Al12, Mg2Al3 and α-Al sublayers at 450 ℃. The bond strength of the joint was meas- ured by three-point bend test. The results show that the bond strength of the specimen prepared at 450 ℃ is higher than that prepared at 420 ℃. The maximum bond strength is obtained in the specimen prepared at 450 ℃ and held for 90min.

关 键 词：镁合金 铝合金 界面显微组织 结合强度 

分 类 号：TG146.4[一般工业技术—材料科学与工程]