大功率LED的散热封装  

Thermal Design of High-Power LED

作　　者：王耀明[1] 王德苗[1] 苏达[1] 

机构地区：[1]浙江大学信息科学与工程学院,浙江杭州310027

出　　处：《江南大学学报（自然科学版）》2009年第1期58-61,共4页Joural of Jiangnan University (Natural Science Edition)　

摘　　要：如何提高大功率LED的散热性能,是LED器件封装及其应用的关键技术。提出了一种LED薄膜集成封装结构,利用磁控溅射技术制备了实验样品,依据动态电学法,采用金相显微镜和扫描电镜对样品的热阻和膜层性能进行了测试,通过对传热模型的仿真以及实验,分析了样品的散热性能。与现有的PCB封装结构相比,薄膜封装结构的散热性能远优于PCB结构,而且薄膜封装结构的工艺简单、成本低廉,适合于大规模的工业化生产,具有良好的应用前景。The issue of heat-release has become the biggest obstacle to the industrialization of high-power LED. To solve these problems, the proposes a new thin-film packaging produced by magnetron sputtering for high-power LED. The thermal performance is demonstrated through simulation of the heat-transfer model and experiments. Compared with the current packaging, the results show that both the internal and total thermal resistances are much smaller. Because of the simple process and low cost, the structure is more applicable than other methods.

关 键 词：大功率LED 薄膜封装 热分析 ANSYS软件 

分 类 号：TN312.8[电子电信—物理电子学]